Package devices and methods of manufacture
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTung-Liang Shao, Yu-Sheng Huang, Chen-Hua Yu
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Abstract
A device is provided that includes: a photonic integrated circuit; a laser die comprising a welding pad; and a first optical fiber including: a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of the photonic integrated circuit; and a second end of the first optical fiber fused to the welding pad, wherein a second fusion bond exists between the second end of the first optical cable and the welding pad.
Claims20
A method of manufacturing a semiconductor device comprising:
- placing a first optical fiber in physical contact with a first integrated circuit device, the first integrated circuit device including a first welding pad;
- welding the first optical fiber to the first welding pad of the first integrated circuit device using a first welding process;
- and
- welding the first optical fiber to a second welding pad of a second integrated circuit device using a second welding process.
A method comprising:
- bonding a photonic integrated circuit to a circuit board;
- bonding a laser die to the circuit board adjacent to the photonic integrated circuit;
- laser welding a first optical cable to the photonic integrated circuit;
- and
- laser welding the first optical cable to the laser die.
A device comprising:
- a photonic integrated circuit;
- a laser die comprising a welding pad;
- and
- a first optical fiber comprising:
- a first end of the first optical fiber fused to a surface of the photonic integrated circuit, wherein a first fusion bond exists between the first end of the first optical fiber and the surface of the photonic integrated circuit;
- and
- a second end of the first optical fiber fused to the welding pad, wherein a second fusion bond exists between the second end of the first optical fiber and the welding pad.
Dependencies are inferred from the claim text.