Substrate processing apparatus and method

A substrate processing apparatus comprising:

• a first stage supporting a substrate;
• an inkjet head unit ejecting a substrate processing liquid onto the substrate as droplets;
• a gantry unit moving the inkjet head unit on the first stage;
• a droplet inspection unit inspecting the droplets;
• and
• a control unit performing compensation on the substrate based on results of the inspection of the droplets,
• wherein
• the inkjet head unit ejects the substrate processing liquid onto a usage area and a non-usage area of the substrate,
• the droplet inspection unit inspects the droplets ejected onto the non-usage area,
• the droplet inspection unit inspects the droplets in units of swaths,
• the swaths are associated with a number of times pixel printing has been performed on an entire surface of the substrate,
• the droplet inspection unit inspects the droplets for nozzles that have been used to process the substrate, among a plurality of nozzles within the inkjet head unit, and
• the control unit performs compensation on the substrate by replacing defective nozzles with replacement nozzles,
• the droplet inspection unit comprises multiple distance measurement sensors,
• the control unit is configured to determine whether one or more nozzles are defective among a plurality of nozzles using whether the droplets are ejected or not, a height of the droplets, an area of the droplets, a volume of the droplets, and an ejected position of the droplets based on measurement of the multiple distance measurement sensors, and
• the ejecting of the substrate processing liquid by the inkjet head unit and the inspecting of the droplets by the droplet inspection unit are performed simultaneously to respond to jetting abnormality caused by the defective nozzles.

A substrate processing method comprising:

• ejecting a substrate processing liquid onto a usage area and a non-usage area of a substrate;
• inspecting droplets ejected onto the non-usage area;
• and
• performing compensation on the substrate based on results of the inspection of the droplets,
• wherein;
• the performing compensation comprises performing compensation on the substrate depending on whether there are any defective nozzles among nozzles used to process the substrate,
• the substrate processing method further comprises determining whether one or more nozzles are defective among a plurality of nozzles using whether the droplets are ejected or not, a height of the droplets, an area of the droplets, a volume of the droplets, and an ejected position of the droplets based on measurement of multiple distance measurement sensors, and
• the ejecting of the substrate processing liquid and the inspecting of the droplets are performed simultaneously to respond to jetting abnormality caused by the any defective nozzles.