Substrate processing apparatus
AssigneeTDK Corporation
InventorsYohei Sato, Osamu Shindo, Hiroshi Koizumi, Makoto Yamashita, Yasuo Kato, Mitsuyoshi Makida, Masashi Matsumoto
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Abstract
Provided is a substrate processing apparatus capable applying a uniform load to an object to be pressurized. The substrate processing apparatus includes a lower jig plate 46 for arranging a substrate 2 which is an object to be pressurized, an upper jig plate 44 applying pressure to the substrate 2 arranged to the lower jig plate 46, and a support member 45 supporting the lower jig plate 46 and providing a support force to the lower jig plate 46 in accordance with a in-plane distribution of a load applied to the lower jig plate 46.
Claims9
A substrate processing apparatus comprising
- a lower jig plate for arranging an object to be pressurized,
- an upper jig plate for pressurizing the object arranged on the lower jig plate, and
- a support member supporting the lower jig plate and providing the lower jig plate with a supporting force in accordance with an in-plane distribution of a load applied to the lower jig plate, wherein
- the support member includes columnar members supporting the lower jig plate,
- the columnar members are formed of members having different shapes or Young's moduli, and the support member adjusts the in-plane distribution of the load applied to the lower jig plate by the columnar members having properties exhibiting different strain amounts when a certain load is applied, and
- each of the columnar members is formed of a single columnar resiliently deformable solid body.
Dependencies are inferred from the claim text.