US 12,552,082 B2Granted

Resin residue removal device

AssigneeKyoraku Co., Ltd.

InventorTadatoshi Tanji

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Abstract

A resin residue removal device is provided that is capable of appropriately removing a resin residue adhered to a lower surface of a die of a molding apparatus. The present invention provides a resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device including a moving mechanism and a resin residue removal head, wherein the moving mechanism is configured to move the resin residue removal head between a lateral position out of a position immediately below the die and an immediately below position as the position immediately below, and also in the immediately below position, to move the head between a separate position separate from the lower surface and a close position close to the lower surface, and the resin residue removal head is configured to allow removal of the resin residue adhered to the lower surface by moving along the lower surface.

Claims14

Dependent claims

A resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device comprising a moving mechanism and a resin residue removal head, wherein

the moving mechanism includes:
a support arm;
a guide mechanism;
a sliding member;
and a linear drive mechanism,
the support arm supports the resin residue removal head on a distal end side of the arm and is supported by the sliding member,
the moving mechanism is configured to move the resin residue removal head between a lateral position out of a position immediately below the die and an immediately below position as the position immediately below by sliding the sliding member along the guide mechanism by driving of the linear drive mechanism, and also in the immediately below position, to move the head between a separate position separate from the lower surface and a close position close to the lower surface,
the resin residue removal head is configured to allow removal of the resin residue adhered to the lower surface by moving along the lower surface, and
the moving mechanism includes at least one configuration of (1) or (2) below:
(1) a configuration in which horizontal movement of the support arm causes the resin residue removal head to move between the lateral position and the immediately below position;
or
(2) a configuration in which seesaw pivoting of the support arm causes the resin residue removal head to move between the separate position and the close position.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/262,032Filed 19 Jan 2022
Priority: JP 2021-00965025 Jan 2021
Published: US 2024/0109238 A14 Apr 2024
Granted: 17 Feb 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

B29C 49/42403
Component parts, details or accessories; Auxiliary operations: purging or cleaning the blow-moulding apparatus
B29C 33/72
Maintenance: cleaning
B29C 35/16
Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor: cooling
B29C 37/00
Component parts, details, accessories or auxiliary operations, not covered by group b29c33/00