Systems and methods for ultrasonic additive manufacturing of metals
AssigneeUniversity of Tennessee Research Foundation
InventorsMichael Barnes Pagan, Steven Zinkle, Sudarsanam Babu
Life of this patent
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Abstract
Provided are methods and apparatus for bonding metals. In an example, a provided method includes (i) disposing a layer of Vanadium onto a first Titanium surface of a first tangible object, (ii) placing a second Titanium surface of a second tangible object in direct contact with the layer of Vanadium, and (iii) imparting, using a sonotrode, compressive and shear forces to the first Titanium surface, the layer of Vanadium, and the second Titanium surface, to cause plastic deformation that bonds the first Titanium surface to the second Titanium surface.
Claims19
A method for bonding metals, comprising:
- diffusing a metallic interlayer into a first metallic surface of a first tangible object to stabilize a crystal structure in the first metallic surface, wherein the first metallic surface has a hexagonal close packed crystal structure prior to the diffusing;
- placing, following the diffusing step, a second metallic surface of a second tangible object in direct contact with the metallic interlayer, wherein the second metallic surface is comprised of a metal different than that of the first metallic surface;
- and
- imparting, using a sonotrode, compressive and shear forces to the first metallic surface and the second metallic surface, to cause plastic deformation that bonds the first metallic surface to the second metallic surface via the metallic interlayer.
A non-transitory computer-readable medium, comprising processor-executable instructions stored thereon configured to cause a processor to control:
- diffusing a metallic interlayer into a first metallic surface of a first tangible object to stabilize a crystal structure in the first metallic surface, wherein the first metallic surface has a hexagonal close packed crystal structure prior to the diffusing;
- placing, following the diffusing step, a second metallic surface of a second tangible object in direct contact with the metallic interlayer, wherein the second metallic surface is comprised of a metal different than that of the first metallic surface;
- and
- imparting, using a sonotrode, compressive and shear forces to the first metallic surface and the second metallic surface, to cause plastic deformation that bonds the first metallic surface to the second metallic surface via the metallic interlayer.
Dependencies are inferred from the claim text.