Solder supply unit, solder piece manufacturing device, part mounting device, and production system

A solder piece manufacturing device, comprising:

• a solder cutting unit cutting a tape-like solder material at a predetermined length into a solder piece;
• and
• a solder supply unit supplying the tape-like solder material to the solder cutting unit, wherein
• the solder cutting unit comprises:
• a cutting part cutting the tape-like solder material;
• a first holding part including a pair of holding members that hold the tape-like solder material and that are moved in a feeding direction of the tape-like solder material;
• and
• an attachment guide member being attached to the solder supply unit, wherein
• the solder supply unit comprises:
• a reel holder rotatably holding a reel of the tape-like solder material;
• and
• a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out, wherein
• the guidance member comprises:
• an extension portion guiding a lower surface of the tape-like solder material along the feeding direction;
• and
• an opening penetrating the extension portion in an up-down direction and extending toward an upstream side in the feeding direction from a downstream end of the guidance member, wherein
• the opening is formed in the predetermined length so that one of the holding members is able to move in the feeding direction, wherein
• the solder supply unit is able to be attached to a solder cutting unit and is able to detached, and the attachment guide member is inserted into the opening from the downstream end.

A solder piece manufacturing device, comprising:

• a solder cutting unit cutting a tape-like solder material at a predetermined length into a solder piece;
• and
• a solder supply unit supplying the tape-like solder material to the solder cutting unit, and to be configured to be able to be attached to a solder cutting unit and be able to detached, wherein
• the solder cutting unit comprises:
• a cutting part cutting the tape-like solder material;
• a first holding part including a pair of holding members that hold the tape-like solder material when the tape-like solder material is fed out;
• and
• a first drive part moving the holding members linearly in a feeding direction of the tape-like solder material, wherein
• the solder supply unit comprises:
• a reel holder holding a reel of the tape-like solder material;
• and
• a guidance member guiding the tape-like solder material wound around the reel when the tape-like solder material is fed out, wherein
• the guidance member comprises:
• an extension portion guiding a lower surface of the tape-like solder material along the feeding direction;
• and
• an opening penetrating the extension portion in an up-down direction, the opening being formed in the predetermined length so that one of the holding members is able to move in the feeding direction, wherein
• the cutting part includes:
• a cutting member;
• a second drive part actuating the cutting member;
• wherein the first drive part and the second drive part each have an actuator as a drive source,
• wherein the each actuator drives linear motion in the feeding direction.