Apparatus and method of treating spinous processes
AssigneeSpinal Elements, Inc.
InventorsEugene Shoshtaev, Roberto Monterroso, Jason Blain, Forrest Samuel
Life of this patent
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Abstract
An interspinous process device includes a first plate, a second plate, and a transverse member between the first plate and the second plate, wherein the second plate is adjustably coupled to the transverse member. A post is coupled to the transverse member and a spring mechanism is disposed between the post and the first plate. The spring mechanism is configured to provide a preloaded compression force to the first and second plates. Methods of implanting the interspinous process device using an inserter tool are also disclosed.
Claims17
A method of implanting an interspinous process device, comprising:
- delivering an assembly in an interspinous space between a superior spinous process and an inferior spinous process, the assembly comprising a first plate, a spring mechanism and a transverse member coupled to the first plate, wherein the assembly is delivered laterally such that the transverse member is inserted in the interspinous space and the first plate is adjacent a first side of the spinous processes;
- delivering a second plate to a second side of the spinous processes and mounting the second plate to the transverse member;
- applying a preload to the spring mechanism prior to compressing the first plate and the second plate together;
- compressing the first plate and the second plate together while maintaining the preload to the spring mechanism;
- and
- actuating a fastener to lock the second plate to the transverse member.
A method of implanting an interspinous process device, comprising:
- delivering an assembly between a superior spinous process and an inferior spinous process, the assembly comprising a first plate, a second plate, a spring mechanism and a transverse member coupled to the first plate and the second plate, wherein the assembly is delivered from a posterior approach in a first orientation;
- rotating the assembly in the implant site to a second orientation;
- applying a preload to the spring mechanism prior to compressing the first plate and the second plate together;
- compressing the first plate and the second plate together while maintaining the preload to the spring mechanism;
- and
- actuating a fastener to lock the second plate to the transverse member.
A method of implanting an interspinous process device, comprising:
- delivering an assembly in an interspinous space between a superior spinous process and an inferior spinous process, the assembly comprising a first plate comprising a hole, a post disposed through the hole, a spring mechanism that is maintained in a preloaded configuration with a lock, and a transverse member to which the first plate is indirectly connected and the post is coupled, wherein the assembly is delivered such that the transverse member is inserted in the interspinous space and the first plate is adjacent a first side of the spinous processes;
- delivering a second plate to a second side of the spinous processes, the second plate comprising an aperture, and mounting the second plate to the transverse member, such that the transverse member fits through the aperture;
- compressing the first plate and the second plate together;
- and
- actuating a fastener to lock the second plate to the transverse member.
Dependencies are inferred from the claim text.