Copper/ceramic assembly, insulating circuit substrate, production method for copper/ceramic assembly, and production method for insulating circuit substrate
AssigneeMitsubishi Materials Corporation
InventorsNobuyuki Terasaki, Akira Sakurai
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Abstract
This copper/ceramic assembly includes: a copper member consisting of copper or a copper alloy; and a ceramic member, wherein the copper member and the ceramic member are bonded to each other. At a bonded interface between the ceramic member and the copper member, an active metal compound layer is formed on a side of the ceramic member. In a region extending by 10 μm from the active metal compound layer toward a side of the copper member, an area rate of an active metal carbide is 8% or less.
Claims16
A copper/ceramic assembly obtained by bonding a copper member consisting of copper or a copper alloy to a ceramic member,
- wherein at a bonded interface between the ceramic member and the copper member, an active metal compound layer is formed on a side of the ceramic member, and
- in a region extending by 10 μm from the active metal compound layer toward a side of the copper member, an area rate of an active metal carbide is 0.6% or more and 8% or less.
An insulating circuit substrate obtained by bonding a copper sheet consisting of copper or a copper alloy to a surface of a ceramic substrate,
- wherein at a bonded interface between the ceramic substrate and the copper sheet, an active metal compound layer is formed on a side of the ceramic substrate, and
- in a region extending by 10 μm from the active metal compound layer toward a side of the copper sheet, an area rate of an active metal carbide is 0.6% or more and 8% or less.
Dependencies are inferred from the claim text.