Temperature measurement method and heat treatment apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorsTakahiro Kitazawa, Hikaru Kawarazaki
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AssigneeSCREEN Holdings Co., Ltd.
InventorsTakahiro Kitazawa, Hikaru Kawarazaki
Estimating the term…
A temperature measurement method includes: a radiation temperature measurement step for detecting a brightness temperature of a semiconductor wafer from obliquely below the semiconductor wafer; an input parameter calculation step for calculating at least two input parameters from the brightness temperature detected in the radiation temperature measurement step, the at least two input parameters including a first input parameter corresponding to an emissivity ratio of the semiconductor wafer and a second input parameter corresponding to a temperature of the semiconductor wafer; an output parameter estimation step for estimating an output parameter from the first input parameter and the second input parameter; and a temperature calculation step for calculating the temperature of the semiconductor wafer from the output parameter estimated in the output parameter estimation step and the brightness temperature detected in the radiation temperature measurement step.
A method of measuring a temperature of a substrate heated by irradiation with light, said method comprising the steps of:
A heat treatment apparatus for irradiating a substrate with light to heat the substrate, comprising:
Dependencies are inferred from the claim text.