Miniaturized optical sensor package and manufacturing method thereof
AssigneePixart Imaging Inc.
InventorsChi-Chih Shen, Kuo-Hsiung Li, Shang-Feng Hsieh, Jui-Cheng Chuang, Yi-Chang Chang
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Abstract
There is provided an optical sensor package including a substrate, a base layer, an optical detection region, a light source and a light blocking wall. The base layer is arranged on the substrate. The light detection region and the light source are arranged on the base layer. The light blocking wall is arranged on the base layer, and located between the light detection region and the light source to block light directly propagating from the light source to the light detection region.
Claims6
A manufacturing method of an optical sensor package, the manufacturing method comprising:
- arranging an optical sensor chip, which comprises a base layer, a light detection region arranged in the base layer and a light source arranged on and electrically coupled to the base layer, on an upper surface of a substrate;
- arranging a first light blocking wall on the base layer of the optical sensor chip between the light detection region and the light source;
- forming a transparent layer to encapsulate the upper surface of the substrate, the optical sensor chip and the first light blocking wall;
- cutting the transparent layer upon the first light blocking wall to form a groove reaching the first light blocking wall;
- and
- injecting opaque plastic, in a fluid state or semi-fluid state, in the groove and then curing the opaque plastic to form a second light blocking wall stacked on the first light blocking wall,
- wherein the transparent layer is disposed on the optical sensor chip and the first light blocking wall, the groove exposes the first light blocking wall, an upper part of the groove has a first width, and a lower part of the groove has a second width smaller than the first width.
Dependencies are inferred from the claim text.