Package comprising an acoustic device and a cap substrate comprising an inductor

A package comprising:

• an acoustic device comprising:
• a substrate;
• and
• an acoustic element coupled to the substrate;
• a frame coupled to the acoustic device;
• a cap substrate coupled to the acoustic device through the frame,
• wherein the cap substrate is a single glass layer comprising a first surface and a second surface, wherein the second surface is opposite to the first surface,
• wherein the cap substrate includes an inductor defined by a plurality inductor interconnects,
• wherein a first set of inductor interconnects from the plurality of inductor interconnects are located at least partially in the single glass layer,
• wherein a second set of inductor interconnects from the plurality of inductor interconnects are located on the first surface of the single glass layer,
• wherein a third set of inductor interconnects from the plurality of inductor interconnects are located on the second surface of the single glass layer, and
• wherein the cap substrate is configured as a cap for the acoustic device,
• a first plurality of interconnects comprising one or more interconnects that extend through (i) the entire thickness of the cap substrate and (ii) the frame, to a surface of the substrate, wherein a side wall of the one or more interconnect that touches the frame has a vertical curve;
• and
• a cavity located between the acoustic device and the first surface of the cap substrate, wherein at least part of the first set of inductor interconnects is exposed to the cavity.