Method of manufacture for single crystal capacitor dielectric for a resonance circuit

An acoustic resonator device comprising:

• a bulk substrate member, having a surface region, and a thickness of material, the bulk substrate having a first recessed region and a second recessed region, and a support member disposed between the first recessed region and the second recessed region;
• a thickness of single crystal piezo material formed overlying the surface region, the thickness of single crystal piezo material having an exposed backside region configured with the first recessed region and a contact region configured with the second recessed region;
• a first electrode member formed overlying an upper portion of the thickness of single crystal piezo material;
• a second electrode member formed overlying a lower portion of the thickness of single crystal piezo material to sandwich the thickness of single crystal piezo material with the first electrode member and the second electrode member, the second electrode member extending from the lower portion that includes the exposed backside region to the contact region;
• a dielectric material formed overlying an upper surface region of a resulting structure overlying the bulk substrate member, wherein the resulting structure includes at least the first and second electrode members;
• and
• an acoustic reflector structure configured overlying the first electrode member, the upper portion, the lower portion, and the second electrode member.