Mold for printing wiring and method for manufacturing display device using the same
AssigneeSamsung Display Co., Ltd.
InventorsJong Hyup Kim, Hae Wook Yang
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Display Co., Ltd.
InventorsJong Hyup Kim, Hae Wook Yang
Estimating the term…
A mold for printing a wiring includes: a bendable part between a first lever part and a second lever part; a first protruding portion protruding from a top face of the bendable part; a second protruding portion protruding from the top face of the bendable part and at one side of the first protruding portion; and a third protruding portion protruding from the top face of the bendable part and at the other side of the first protruding portion. The first and second protruding portions are spaced apart from each other with a first hinge groove therebetween, the first and third protruding portions are spaced apart from each other with a second hinge groove therebetween, and a width of each of the first and second hinge grooves increases as they respectively extends upwardly in the thickness direction.
A mold for printing a wiring, the mold comprising:
A mold for printing a wiring, the mold comprising:
Dependencies are inferred from the claim text.