Methods and devices for high resistance and low resistance conductor layers mitigating skin depth loss
AssigneeAveratek Corporation
InventorShinichi Iketani
Life of this patent
Estimating the term…
Abstract
Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed or otherwise impressed such that it has a Ra of at least 5 μm. The ratio of resistivity between the HRCM and the conductor is at least 50:1 or 100:1, and the ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.
Claims15
A method of forming conductive layers, comprising:
- depositing a resistive material on a surface of a substrate, wherein the resistive material is conductive, and
- depositing a conductive material on a surface of the resistive material, wherein an arithmetic average roughness (Ra) of the surface of the resistive material in contact with the conductive material is at least half an Ra of the surface of the substrate in contact with the resistive material;
- wherein the step of depositing the resistive material on the substrate comprises first depositing a conductive layer to the substrate followed by depositing the resistive material to the conductive layer, such that the conductive layer is between the substrate and the resistive material.
A method of forming conductive layers, comprising:
- depositing a resistive material on a surface of a substrate, wherein the resistive material is conductive, and
- depositing a conductive material on a surface of the resistive material, wherein an arithmetic average roughness (Ra) of the surface of the resistive material in contact with the conductive material is at least half an Ra of the surface of the substrate in contact with the resistive material;
- wherein a ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.
A method of forming conductive layers, comprising:
- depositing a resistive material on a surface of a substrate, wherein the resistive material is conductive, and
- depositing a conductive material on a surface of the resistive material, wherein an arithmetic average roughness (Ra) of the surface of the resistive material in contact with the conductive material is at least half an Ra of the surface of the substrate in contact with the resistive material;
- wherein a ratio of resistivity between the resistive material and the conductive layer is at least 50:1 or 100:1.
Dependencies are inferred from the claim text.