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US 12,547,076 B2Granted
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorKoichi Matsunaga
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus includes a hydrophobizing part configured to perform a hydrophobizing process of forming a hydrophobic film on a front surface of a substrate through vapor deposition of a hydrophobizing gas, an ultraviolet radiation part configured to radiate ultraviolet rays to a removal area on a rear surface of the substrate so as to remove the hydrophobic film formed in the removal area in the hydrophobizing process, and a resin-film forming part configured to form a fluororesin film in the removal area after the hydrophobic film is removed.
Claims9
A substrate processing apparatus comprising:
- a hydrophobizing part configured to perform a hydrophobizing process of forming a hydrophobic film on a front surface of a substrate through vapor deposition of a hydrophobizing gas;
- an ultraviolet radiation part configured to radiate ultraviolet rays to a removal area on a rear surface of the substrate so as to remove the hydrophobic film formed in the removal area in the hydrophobizing process;
- a resin-film forming part configured to form a fluororesin film in the removal area after the hydrophobic film is removed;
- a holding arm configured to hold the substrate and to be movable;
- a coating film forming part configured to form a coating film on the front surface of the substrate by supplying a processing liquid to the front surface of the substrate after forming the fluororesin film;
- and
- a development part configured to perform a development process on the substrate after an exposure process is performed on the coating film,
- wherein the holding arm covers at least a portion of a non-removal area other than the removal area in a state that the holding arm holds the substrate,
- wherein the ultraviolet radiation part is located below a moving line in which the substrate moves between a standby position of the holding arm and a delivery position within the resin-film forming part,
- wherein the removal area is set to an area other than a peripheral edge portion of the rear surface,
- wherein the ultraviolet radiation part comprises:
- an ultraviolet illumination part configured to be capable of radiating the ultraviolet rays to an area including the removal area;
- and
- a light-blocking member disposed between the ultraviolet illumination part and the rear surface and configured to block the ultraviolet rays radiated to the non-removal area other than the removal area on the rear surface, and
- wherein the light-blocking member includes the holding arm and a cover member disposed between the holding arm and the ultraviolet illumination part.
12 more elements
A substrate processing apparatus comprising:
- a hydrophobizing part configured to perform a hydrophobizing process of forming a hydrophobic film on a front surface of a substrate through vapor deposition of a hydrophobizing gas;
- an ultraviolet radiation part configured to radiate ultraviolet rays to a removal area on a rear surface of the substrate so as to remove the hydrophobic film formed in the removal area in the hydrophobizing process;
- a resin-film forming part configured to form a fluororesin film in the removal area after the hydrophobic film is removed;
- a holding arm configured to hold the substrate and to be movable,
- wherein the holding arm covers at least a portion of a non-removal area other than the removal area in a state that the holding arm holds the substrate,
- wherein the ultraviolet radiation part is located below a moving line in which the substrate moves between a standby position of the holding arm and a delivery position within the resin-film forming part, and
- wherein the ultraviolet radiation part comprises:
- an ultraviolet illumination part configured to be capable of radiating the ultraviolet rays to an area including the removal area;
- and
- a light-blocking member disposed between the ultraviolet illumination part and the rear surface and configured to block the ultraviolet rays radiated to the non-removal area other than the removal area on the rear surface, and
- wherein the light-blocking member includes the holding arm and a cover member disposed between the holding arm and the ultraviolet illumination part.
8 more elements
A substrate processing apparatus comprising:
- a hydrophobizing part configured to perform a hydrophobizing process of forming a hydrophobic film on a front surface of a substrate through vapor deposition of a hydrophobizing gas;
- an ultraviolet radiation part configured to radiate ultraviolet rays to a removal area on a rear surface of the substrate so as to remove the hydrophobic film formed in the removal area in the hydrophobizing process;
- a resin-film forming part configured to form a fluororesin film in the removal area after the hydrophobic film is removed;
- a holding arm configured to hold the substrate and to be movable,
- wherein the holding arm covers at least a portion of a non-removal area other than the removal area in a state that the holding arm holds the substrate,
- wherein the ultraviolet radiation part is located below a moving line in which the substrate moves between a standby position of the holding arm and a delivery position within the resin-film forming part,
- wherein the ultraviolet radiation part includes:
- an ultraviolet illumination part configured to be capable of radiating the ultraviolet rays to an area including the removal area;
- and
- a light-blocking member disposed between the ultraviolet illumination part and the rear surface and configured to block the ultraviolet rays radiated to the non-removal area other than the removal area on the rear surface,
- wherein the light-blocking member includes:
- a holder, which is different from the holding arm, configured to hold the substrate;
- and
- a cover member disposed between the holder and the ultraviolet illumination part, and
- wherein the cover member includes:
- a central hole penetrating the cover member in a thickness direction of the cover member in a central portion;
- and
- a plurality of peripheral holes penetrating the cover member in the thickness direction in an outer peripheral portion of the central hole.
15 more elements
Dependencies are inferred from the claim text.