Probe-card multilayer wiring substrate and probe card

Abstract

An object of the present invention is to provide a multilayer wiring substrate for probe card capable of preventing deterioration of a thin film resistor 30. Provided is a multilayer wiring substrate (an ST substrate) 15 for probe card, the multilayer wiring substrate being provided on a wiring path between an external terminal 120 and a probe 17 of a probe card 100, and having a base insulating film 41 formed on a top surface of the multilayer wiring substrate, in which the multilayer wiring substrate 15 includes: a thin film resistor 30 including a thin film formed on the base insulating film 41 and to which a pair of connection electrodes 33 are connected; an embedded heat sink 31 that is embedded to face the thin film resistor 30 via the base insulating film 41 and includes a material having a thermal conductivity higher than that of the base insulating film 41; and a cover insulating film 43 that is formed in a region corresponding to the thin film resistor 30 and covers the thin film resistor 30, and the embedded heat sink 31 includes a heat dissipating portion 50 that is not covered with the base insulating film 41 outside a region in which the cover insulating film 43 is formed.

Dependencies are inferred from the claim text.