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US 12,545,810 B2Granted
Magnetic polishing slurry and method for polishing a workpiece
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJi Cui, Chih Hung Chen, Kei-Wei Chen
Life of this patent
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Abstract
A magnetic polishing slurry for polishing a workpiece includes magnetic particles coated with a modifying material, a liquid carrier, and abrasives. The modifying material has a hardness lower than that of the workpiece.
Claims20
A magnetic polishing slurry for polishing a wafer, comprising:
- magnetic particles coated with a modifying material, wherein a hardness of the modifying material is lower than a hardness of the wafer;
- a liquid carrier, which is an oily medium selected from mineral oil, vegetable oil, silicone oil, and combinations thereof;
- abrasives;
- a corrosion inhibitor selected from the group consisting of:
- 1,2,4-triazole and derivatives thereof, 1,2,3-triazole and derivatives thereof, pyrazole and derivatives thereof, imidazole, benzimidazole and derivatives thereof, isocyanurate and derivatives thereof, an aromatic amine, and combinations thereof;
- and
- a pH-adjusting agent selected from triethanolamine, dimethylbenzylamine and ethoxybenzylamine,
- wherein the modifying material comprises a polymer, and wherein the polymer comprises an elastomer.
5 more elements
A magnetic polishing slurry for polishing a wafer, comprising:
- magnetic particles having a hardness lower than a hardness of the wafer, wherein the magnetic particles include europium, europium oxide, a europium alloy, an europium sulfate, an europium halide, an europium complex or combinations thereof, and wherein the magnetic particles have a particle size ranging from about 5.0 μm to about 5000 μm;
- a liquid carrier, which is an oily medium selected from mineral oil, vegetable oil, silicone oil, and combinations thereof;
- and
- abrasives selected from silicon oxide particles,
- wherein the magnetic polishing slurry further comprises a corrosion inhibitor selected from 1,2,4-triazole and derivatives thereof, 1,2,3-triazole and derivatives thereof, pyrazole and derivatives thereof, imidazole, benzimidazole and derivatives thereof, isocyanurate and derivatives thereof, and an aromatic amine.
2 more elements
A magnetic polishing slurry for polishing a wafer, comprising:
- magnetic particles coated with a modifying material, wherein a hardness of the modifying material is lower than a hardness of the wafer;
- a liquid carrier, which is an oily medium selected from mineral oil, vegetable oil, silicone oil, and combinations thereof;
- abrasives;
- and
- a corrosion inhibitor selected from the group consisting of:
- 1,2,4-triazole and derivatives thereof, 1,2,3-triazole and derivatives thereof, pyrazole and derivatives thereof, imidazole, benzimidazole and derivatives thereof, isocyanurate and derivatives thereof, an aromatic amine, and combinations thereof,
- wherein the magnetic particles comprise an alloy of cobalt comprising cobalt with an f-block transition element,
- wherein the modifying material comprises a polymer, and wherein the polymer comprises an elastomer.
5 more elements
Dependencies are inferred from the claim text.