Directly bonded metal structures having oxide layers therein
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsOliver Zhao, Bongsub Lee, Cyprian Emeka Uzoh
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AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsOliver Zhao, Bongsub Lee, Cyprian Emeka Uzoh
Estimating the term…
An element, bonded structure that includes the element, and methods forming the same are disclosed. A bonded structure can include a first element having a first nonconductive field region and a first conductive feature, and a second element having a second nonconductive field region and a second conductive feature. The second element is directly hybrid bonded to the first element such that the first and second nonconductive field regions are directly bonded to one another along a bond interface and the first and second conductive features are directly bonded to one another. The first conductive feature can include a perforated oxide layer. 1 at. % to 20 at. % of the first aluminum feature can be aluminum oxide.
A bonded structure comprising:
Dependencies are inferred from the claim text.