Substrate processing method
AssigneeEbara Corporation
InventorsMasayuki Satake, Masayuki Nakanishi
Life of this patent
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Abstract
The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.
Claims18
A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
- applying a first filler to a gap between a bevel portion of the bonded first substrate constituting the laminated substrate and a bevel portion of the bonded second substrate constituting the laminated substrate;
- and
- applying a second filler to the gap after applying of the first filler to fill the gap with the first filler and the second filler, a viscosity of the first filler being lower than a viscosity of the second filler.
A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
- applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
- applying a second filler to the gap after applying of the first filler, a viscosity of the first filler being lower than a viscosity of the second filler;
- applying a third filler to the gap after applying of the second filler;
- and
- post-processing for the laminated substrate after applying of the third filler,
- wherein the third filler has chemical resistance that does not allow the third filler to be dissolved by a processing liquid for use in the post-processing.
A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
- applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
- applying a second filler to the gap after applying of the first filler, a viscosity of the first filler being lower than a viscosity of the second filler;
- and
- applying a third filler to the gap after applying of the second filler, a viscosity of the third filler being higher than the viscosity of the second filler.
A substrate processing method of applying a filler to a laminated substrate having a first substrate and a second substrate bonded to each other, comprising:
- applying a first filler to a gap between an edge portion of the bonded first substrate constituting the laminated substrate and an edge portion of the bonded second substrate constituting the laminated substrate;
- applying a second filler to the gap after applying of the first filler;
- and
- post-processing for the laminated substrate after applying of the second filler,
- wherein the second filler has chemical resistance that does not allow the second filler to be dissolved by a processing liquid for use in the post-processing.
Dependencies are inferred from the claim text.