Method for producing silver particles, thermosetting resin composition, semiconductor device, and electrical and/or electronic components

A method of producing a thermosetting resin composition comprising a plurality of silver particles, the plurality of silver particles each including secondary particles having an average particle size from 0.5 to 5.0 μm, the secondary particles formed by an aggregation of primary particles having an average particle size from 10 to 100 nm, the method comprising:

• obtaining a silver ammine complex solution by adding ammonia water to an aqueous solution containing a silver compound;
• and
• obtaining a silver particle-containing slurry by reducing, with a reducing compound, a silver ammine complex contained in the obtained silver ammine complex solution,
• wherein the silver ammine complex solution is maintained between 0 and 20° C. when reducing the silver ammine complex,
• dispersing the silver particles of the silver particle-containing slurry in a thermosetting resin,
• and curing the thermosetting resin composition,
• wherein each of the plurality of the silver particles is a hollow particle having a void within each respective particle, and wherein the thermal
• resistance of the cured thermosetting resin composition is 0.5 K/W or less.