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US 12,544,809 B2Granted
Conditioning chamber component
AssigneeLam Research Corporation
InventorsAmir A. Yasseri, Hong Shih, John Daugherty, Duane Outka, Lin Xu, Armen Avoyan, Cliff La Croix, Girish M Hundi
Life of this patent
Estimating the term…
Abstract
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.
Claims17
An apparatus for conditioning a component of a processing chamber, comprising:
- a tank for holding a megasonic conditioning solution;
- a mount for holding the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution;
- a megasonic conditioning solution inlet system for delivering the megasonic conditioning solution to the tank, wherein megasonic conditioning solution inlet system comprises at least one inlet for flowing the megasonic conditioning solution into the tank at a location under where the component is mounted in the tank, and wherein at least part of the inlet is under where the component is held in the megasonic conditioning solution;
- a megasonic transducer head with a length to provide megasonic energy to the megasonic conditioning solution, comprising:
- at least one megasonic transducer;
- and
- a housing positioned between the at least one megasonic transducer and the megasonic conditioning solution, where the megasonic transducer head has a length and wherein the at least one megasonic transducer provides megasonic energy to the megasonic conditioning solution through the housing, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution;
- a megasonic conditioning solution drain system for draining the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution;
- and
- an actuator for moving the megasonic transducer head across the tank above where the component is held in the megasonic conditioning solution,
- wherein the megasonic transducer head faces the at least one inlet and wherein the component is mounted in the mount between the megasonic transducer head and the at least one inlet, so that the megasonic transducer head is above the component and the at least one inlet is directly below the mount, so that some of the megasonic energy from the megasonic transducer head directed towards the at least one inlet reaches the component.
8 more elements
An apparatus for conditioning a component of a processing chamber, comprising:
- a tank for holding a megasonic conditioning solution;
- a mount for holding the component immersed in a megasonic conditioning solution, when the tank is filled with the megasonic conditioning solution;
- a megasonic conditioning solution inlet system for delivering the megasonic conditioning solution to the tank, wherein at least part of the megasonic conditioning solution inlet system is under where the component is held in the megasonic conditioning solution;
- a megasonic transducer head comprising at least one stationary megasonic transducer placed in the tank, the megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution;
- and
- a megasonic conditioning solution drain system for draining the megasonic conditioning solution from the tank at a location above where the component is held in the megasonic conditioning solution,
- wherein megasonic conditioning solution inlet system comprises at least one inlet for flowing the megasonic conditioning solution into the tank at a location under where the component is mounted in the tank,
- wherein the megasonic transducer head faces the at least one inlet and wherein the component is mounted in the mount between the megasonic transducer head and the at least one inlet, so that the megasonic transducer head is above the component and the at least one inlet is directly below the mount, so that some of the megasonic energy from the megasonic transducer head directed towards the at least one inlet reaches the component.
5 more elements
Dependencies are inferred from the claim text.