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US 12,544,806 B2Granted
Wafer cleaning apparatus
AssigneeZeus Co., Ltd.
InventorsSanghoon Lee, Jiho Park, Woon Kong, Ungjo Moon
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Abstract
A wafer cleaning apparatus according to the present disclosure includes a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis, and an ultrasonic vibration device that vibrates a liquid film so that vibration having an ultrasonic frequency is generated in the liquid film formed on an upper surface of the wafer.
Claims18
A wafer cleaning apparatus comprising:
- a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis;
- a cleaning liquid discharge device that discharges a cleaning liquid so that a liquid film is formed on the upper surface of the wafer;
- and
- an ultrasonic vibration device that vibrates the liquid film so that vibration having an ultrasonic frequency is generated in the liquid film,
- wherein the cleaning liquid discharge device includes a first discharge part that is positioned around one side of the ultrasonic vibration device and discharges the cleaning liquid, the one side of the ultrasonic vibration device is where the wafer rotates to enter under the ultrasonic vibration device, and
- wherein the cleaning liquid flows in a direction along a direction in which the wafer rotates after being discharged from the first discharge part and is introduced into the lower portion of the ultrasonic vibration device at the one side of the ultrasonic vibration device, and leaves the lower portion of the ultrasonic vibration device at the other side of the ultrasonic vibration device.
3 more elements
Dependencies are inferred from the claim text.