Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method
OwnerYuta Akasu, Emi Miyazawa +3inventors
InventorsYuta Akasu, Emi Miyazawa, Takashi Kawamori, Yasuyuki Oyama, Tetsuya Enomoto
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Abstract
A method for producing a laminated film for temporary fixation of a semiconductor member to a support member includes providing a first curable resin layer on one surface of a metal foil and providing a second curable resin layer on the other surface of the metal foil to obtain the laminated film. A laminated film used for temporarily fixing a semiconductor member to a support member includes a first curable resin layer, a metal foil, and a second curable resin layer laminated in sequence.
Claims15
A method for producing a laminated film for temporarily fixing a semiconductor member to a support member, the method comprising:
- providing a first curable resin layer on a first surface of a single-layered metal foil;
- and
- providing a second curable resin layer on a second surface of the single-layered metal foil to obtain the laminated film.
A laminated film for temporarily fixing a semiconductor member to a support member,
- the laminated film comprising a first curable resin layer, a single-layered metal foil, and a second curable resin layer laminated in sequence.
A method for producing a semiconductor device including a semiconductor member, the method comprising:
- temporarily fixing the semiconductor member to a support member, with a temporary fixing material layer interposed between the semiconductor member and the support member;
- processing the semiconductor member temporarily fixed to the support member;
- and
- separating the processed semiconductor member from the support member by irradiating the temporary fixing material layer with light from a side of the support member,
- wherein the temporary fixing material layer comprises a first curable resin layer, a second curable resin layer, and a single-layered metal foil laminated between the first curable resin layer and the second curable resin layer on the support member.
Dependencies are inferred from the claim text.