Quantum device
AssigneeNEC Corporation
InventorsSuguru Watanabe, Kunihiko Ishihara, Katsumi Kikuchi
Life of this patent
Estimating the term…
Abstract
A quantum device capable of preventing contacts from being displaced is provided. A quantum device includes a quantum element in which a quantum circuit is provided, a socket including contacts and a housing, the contacts being in contact with a terminal of the quantum element, and the housing supporting the contacts, and a board including a board substrate. At least one of the housing and the board substrate includes a hole, another one of the housing and the board substrate includes a fixing part disposed inside the hole and a body part other than the fixing part, and the fixing part and the body part are integrally formed.
Claims20
A quantum device comprising:
- a superconductive element including a superconductive material;
- a socket including a contact and a housing, the contact being in contact with a terminal of the superconductive element, and the housing supporting the contact;
- and
- a board including a board substrate, wherein
- the housing includes a first end face from which a first end of the contact protrudes, and a second end face from which a second end of the contact protrudes,
- the board is disposed so as to be opposed to the second end face of the housing,
- the board substrate includes a hole,
- the housing includes a fixing part disposed inside the hole and a body part other than the fixing part, and
- the fixing part and the body part are integrally formed.
A quantum device comprising:
- a superconductive element including a superconductive material;
- a socket including a contact and a housing, the contact being in contact with a terminal of the superconductive element, and the housing supporting the contact;
- and
- a board including a board substrate, wherein
- a part of at least one of the superconductive element, the housing, and the board substrate comes into contact with a cooling base having a cooling function,
- at least one of the housing and the board substrate includes a first hole,
- another one of the housing and the board substrate includes a first fixing part disposed inside the first hole and a first body part other than the first fixing part,
- the first fixing part and the first body part are integrally formed,
- at least one of the cooling base and the board substrate includes a second hole,
- another one of the cooling base and the board substrate includes a second fixing part disposed inside the second hole and a second body part other than the second fixing part, and
- the second fixing part and the second body part are integrally formed.
Dependencies are inferred from the claim text.