Composite power electronics cover
AssigneeZoox, Inc.
InventorsLuis Riera, Vishveshwar Ramanathan Subramanian
Life of this patent
Estimating the term…
Abstract
A system for vibration reducing covers for electrical components. The system includes composite covers for electronic components of drive units to reduce vibrations and associated noise during operation of a vehicle. The cover is formed of a composite to dampen oscillations occurring as a result of vibrations from the drivetrain of the vehicle. The cover also includes a thermal pathway for transferring energy as heat from an interior of compartment containing the electronic components to an environment outside the cover. Additionally, the cover can include an electromagnetic interference and/or radio frequency interference shield to prevent interference with other electronic components on and/or nearby the vehicle during operation.
Claims20
A drive unit for an electric vehicle comprising:
- an electric motor;
- a power electronics unit configured to receive a first current from a battery and providing a second current to the electric motor;
- a housing that accommodates the power electronics unit;
- and
- a cover mechanically coupled to the housing that, when coupled to the housing encloses the power electronics unit within a sealed compartment, wherein the cover is formed of a composite material and comprises:
- an electromagnetic compatibility shielding integrally disposed on a surface of the cover, the surface of the cover enclosed within the sealed compartment when the cover is coupled to the housing;
- and
- a heat sink that thermally couples with one or more components of the power electronics unit and an environment outside of the sealed compartment, wherein the heat sink comprises a flanged interface that is configured to provide continuous electromagnetic shielding on the surface of the cover.
A vehicle drive unit of an electric vehicle comprising:
- a motor;
- a housing that accommodates an electronic component of the vehicle drive unit;
- and
- a cover that mechanically couples to the housing to enclose the electronic component, the cover formed of a composite material;
- an electromagnetic compatibility shielding integrally disposed on a surface of the cover, the surface of the cover enclosed within a sealed compartment formed by the cover and the housing;
- and
- a heat sink that thermally couples the electronic component and an environment outside the sealed compartment, wherein the heat sink comprises a flanged interface that is configured to provide continuous electromagnetic shielding on the surface of the cover.
A method of manufacturing a cover for an electronic component, the method comprising:
- forming a composite layer having a geometry configured to interface with a case to enclose the electronic component, the composite layer formed of a material having a first damping coefficient greater than a second damping coefficient of a metal;
- forming a thermal exchange pathway through the cover;
- and
- applying an electromagnetic compatibility shielding to the cover, the electromagnetic compatibility shielding integrally disposed on a surface of the cover, the surface of the cover configured to be enclosed within a sealed compartment when the cover is coupled to a housing, and
- wherein the thermal exchange pathway comprises a flanged interface that is configured to provide continuous electromagnetic shielding on the surface of the cover.
Dependencies are inferred from the claim text.