Reflow oven
AssigneeIllinois Tool Works Inc.
InventorsYuexin Chen, Dong Zhang
Life of this patent
Estimating the term…
Loading patent…
AssigneeIllinois Tool Works Inc.
InventorsYuexin Chen, Dong Zhang
Estimating the term…
The present disclosure discloses a reflow oven for processing a circuit board, the reflow oven comprising a heating zone having a plurality of heating sub-zones, in which the plurality of heating devices are arranged in corresponding heating sub-zones of the plurality of heating sub-zones, and each of the plurality of heating devices is configured such that a working temperature of the corresponding heating sub-zone is in a predetermined temperature interval; a start-stop device configured to activate or deactivate the plurality of heating devices, and configured to activate and deactivate the plurality of heating devices according to predetermined time intervals in a process during which the circuit board sequentially passes through the plurality of heating sub-zones, such that a working temperature of each of the plurality of heating sub-zones is in a corresponding predetermined temperature interval.
A reflow oven for processing a circuit board, wherein the reflow oven comprises:
Dependencies are inferred from the claim text.