# US 12,542,430 B2 · Pressure-resistant medical cable enclosure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,542,430 B2 - Document ID: US12542430B2 - Status: Granted - Kind: B2 - Application number: 18/687,254 - Filed: 2021-08-27 - Published: 2024-12-05 - Granted: 2026-02-03 - Earliest claimed: 2021-08-27 - Assignees: Covidien LP - Applicants: Covidien LP - Inventors: Weimiao Qian; Yi Zhong; Mingdi Lu - Web page: https://patentgrep.com/patent/US12542430B2 ## CPC - H02G 3/0406: {Details thereof (installation or suspension of conduit channels and other supports H02G3/263)} - H02G 15/007: Devices for relieving mechanical stress - A61B 5/14552: {Details of sensors specially adapted therefor} - H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding} - H05K 7/1427: {Housings} - A61B 2562/12: Manufacturing methods specially adapted for producing sensors for in-vivo measurements - A61B 2562/166: the sensor is mounted on a specially adapted printed circuit board - A61B 2562/187: Strain relief means - A61B 2562/222: Electrical cables or leads therefor, e.g. coaxial cables or ribbon cables - A61B 2562/227: Sensors with electrical connectors - H02G: INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A pressure resistant medical cable enclosure is provided, including a clamshell, a printed circuit board, and at least one overmold, wherein the clamshell is configured for assembly over the printed circuit board for a medical cable, one overmold provided at least partially around the clamshell layer with minimal overlap between the overmold and the printed circuit board in the vertical direction. ## Claims ### Claim 1 A pressure resistant medical cable enclosure, comprising: a cable; a printed circuit board, connected to the cable; a clamshell layer having an internal cavity configured to surround the printed circuit board and a portion of the cable, the clamshell layer configured with at least two separate clamshell pieces positioned around the printed circuit board; and an overmold provided at least partially around the clamshell layer and defining a connection cavity for the printed circuit board, the overmold either not overlapping or only partially overlapping a portion of the printed circuit board in the vertical direction. ### Claim 2 (depends on 1) A cable enclosure in accordance with claim 1, wherein at least one clamshell piece includes an aperture, and wherein a soft, inner layer is provided between the clamshell layer and the printed circuit board via injection of such material through the aperture. ### Claim 3 (depends on 1) A cable enclosure in accordance with claim 1, wherein the overmold overlaps the printed circuit board in the vertical direction up to about 5 mm. ### Claim 4 (depends on 1) A cable enclosure in accordance with claim 1, wherein the overmold does not overlap any pressure sensitive components of the printed circuit board in the vertical direction. ### Claim 5 (depends on 1) A cable enclosure in accordance with claim 1, wherein the overmold is formed around at least one projection formed on an edge of at least one clamshell piece. ### Claim 6 (depends on 5) A cable enclosure in accordance with claim 5, wherein the at least two clamshell pieces include at least one projection, wherein the at least two clamshell pieces extend past the printed circuit board and at least partially over a connector, and wherein the overmold is provided over and around such projections. ### Claim 7 (depends on 6) A cable enclosure in accordance with claim 6, wherein the at least two clamshell pieces include both projections and valleys as contours, and wherein the overmold is provided over and around such contours. ### Claim 8 (depends on 1) A cable enclosure in accordance with claim 1, wherein a second overmold is provided at least partially around the first overmold and the clamshell layer as an outer overmold. ### Claim 9 (depends on 1) A cable enclosure in accordance with claim 1, wherein at least one of the clamshell pieces includes reinforcing structures. ### Claim 10 (depends on 1) A cable enclosure in accordance with claim 1, wherein the clamshell layer comprises polycarbonate with glass fiber content. ### Claim 11 A method for making a pressure resistant medical cable enclosure, comprising: providing a cable; providing a printed circuit board and soldering connections from the printed circuit board to the cable; assembling a clamshell layer having an internal cavity configured around the printed circuit board and a portion of the cable, the clamshell layer configured with at least two separate clamshell pieces positioned around the printed circuit board; and forming an overmold provided at least partially around the clamshell layer and defining a connection cavity for the printed circuit board, the overmold either not overlapping or only partially overlapping a portion of the printed circuit board in the vertical direction. ### Claim 12 (depends on 11) A method in accordance with claim 11, wherein at least one clamshell piece includes an aperture, and wherein a soft, inner layer is provided between the clamshell layer and the printed circuit board via injection of such material through the aperture. ### Claim 13 (depends on 11) A method in accordance with claim 11, wherein the overmold overlaps the printed circuit board in the vertical direction up to about 5 mm. ### Claim 14 (depends on 11) A cable enclosure in accordance with claim 11, wherein the overmold does not overlap any pressure sensitive components of the printed circuit board in the vertical direction. ### Claim 15 (depends on 11) A method in accordance with claim 11, wherein the overmold is formed around at least one projection formed on an edge of at least one clamshell piece. ### Claim 16 (depends on 15) A method in accordance with claim 15, wherein the at least two clamshell pieces include at least one projection, wherein the at least two clamshell pieces extend past the printed circuit board and at least partially over a connector, and wherein the overmold is provided over and around such projections. ### Claim 17 (depends on 16) A method in accordance with claim 16, wherein the at least two clamshell pieces include both projections and valleys as contours, and wherein the overmold is provided over and around such contours. ### Claim 18 (depends on 11) A method in accordance with claim 11, wherein a second overmold is provided at least partially around the first overmold and the clamshell layer as an outer overmold. ### Claim 19 (depends on 11) A method in accordance with claim 11, wherein at least one of the clamshell pieces includes reinforcing structures. ### Claim 20 (depends on 11) A method in accordance with claim 11, wherein the clamshell layer comprises polycarbonate with glass fiber content.