Method for manufacturing multilayer ceramic electronic component, and multilayer ceramic electronic component

A multilayer ceramic electronic component having a structure including a stack of a plurality of ceramic layers and a plurality of internal electrodes, the multilayer ceramic electronic component comprising:

• the plurality of ceramic layers;
• the plurality of internal electrodes;
• and
• an electrode-end-portion protecting portion including ceramic material and at least partially overlapping each end portion of the plurality of internal electrodes;
• wherein
• the electrode-end-portion protecting portion is not exposed at any surface of the multilayer ceramic electronic component;
• the electrode-end-portion protecting portion does not extend to end of the plurality of ceramic layers;
• and
• the electrode-end-portion protecting portion is provided directly on at least one end portion of the plurality of internal electrodes and at least partially overlaps the at least one end portion of the plurality of internal electrodes in a stacking direction of the plurality of ceramic layers and the plurality of internal electrodes.

A multilayer ceramic electronic component having a structure including a stack of a plurality of ceramic layers and a plurality of internal electrodes, the multilayer ceramic electronic component comprising:

• the plurality of ceramic layers;
• the plurality of internal electrodes;
• and
• an electrode-end-portion protecting portion including ceramic material and at least partially overlapping each end portion of the plurality of internal electrodes;
• wherein
• the electrode-end-portion protecting portion is not exposed at any surface of the multilayer ceramic electronic component;
• the electrode-end-portion protecting portion does not extend to end of the plurality of ceramic layers;
• and
• a surface of at least a portion of at least one end portion of the plurality of internal electrodes overlapping the electrode-end-portion protecting portion is slanted.