Multilayer electronic component and method for manufacturing multilayer electronic component

A method for manufacturing a multilayer electronic component, the method comprising:

• printing a conductive paste including a conductive metal on a dielectric green sheet including a dielectric composition;
• forming a laminate by laminating the dielectric green sheet on which the conductive paste is printed;
• sintering the laminate at a sintering temperature of 1100° C. to 1400° C. in a reducing atmosphere;
• forming a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer by reoxidizing the sintered laminate in an oxidizing atmosphere at a temperature lower than the sintering temperature;
• and
• forming an external electrode disposed on the body,
• wherein the dielectric composition includes a BaTiO3-based base material main ingredient, a sub-ingredient including Dy, and an additive including one or more of Sm, Gd, and Tb,
• a content of the additive is 25 mol or more and less than 50 mol relative to 100 mol of Dy.

A multilayer electronic component comprising:

• a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer;
• and
• an external electrode disposed on the body,
• wherein the dielectric layer includes a dielectric composition and a plurality of dielectric grains,
• the dielectric composition includes Dy, and an additive that includes one or more of Sm, Gd, and Tb,
• a content of the additive is more than 0 mol and less than 50 mol relative to 100 mol of Dy, and
• wherein the an average thickness of the dielectric layer, td satisfies td≤0.35 μm.