Wafer scale active thermal interposer for device testing

A method of testing an integrated circuit component, said method comprising:

• testing said component by applying signals thereto and comparing results therefrom;
• and
• regulating temperatures of said integrated circuit component during said testing, said regulating temperatures using a test stack, wherein the test stack comprises:
• an active thermal interposer comprising:
• a top surface configured to receive said integrated circuit component in proximity thereto;
• a bottom surface nfigured to be placed upon a cold plate;
• a plurality of independently controllable thermal zones comprising a plurality of independently controllable heating zones configured to maintain or change temperatures on the top surface;
• and
• a plurality of heating elements, assocaited with said plurality of independently controllable heating zones, contained between said top and bottom surfaces;
• a plurality of independently controllable cooling zones configured to maintain of change temperatures on the top surface:
• and
• a power input configured to receive electrical power and wherein said electrical power is configured to be selectively applied to one or more of the plurality of independently controllable heating zones.