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US 12,540,695 B2Granted
Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device
AssigneeKokusai Electric Corporation
InventorsTakuto Shoji, Ryosuke Takahashi, Masakazu Sakata
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Abstract
There is provided a technique that includes: a first connector including a first opening including two longitudinally extending parallel sides and configured to provide a detachable connection to an opening of a first counterpart; and a second connector including a substantially circular second opening and configured to be connectable to an opening of a second counterpart; and a pipe including an internal space formed in a shape of a polyhedron and configured to allow fluid communication between the first opening and the second opening.
Claims20
A conversion pipe arrangement, comprising:
- a first connector including a first opening including two longitudinally extending parallel sides and configured to provide a detachable connection to an opening of a first counterpart;
- a second connector including:
- a plate that has a five-or-more sided polygonal contour;
- a substantially circular second opening that is formed to be opened on one side of the plate and configured to be connectable to an opening of a second counterpart;
- and
- a five-or-more sided polygonal third opening that is formed to be opened on another side of the plate, which is opposite to the one side;
- a pipe including an internal space formed in a shape of a polyhedron and configured to allow fluid communication between the first opening and the second opening;
- and
- a circular member that is connected to the second opening.
6 more elements
Dependencies are inferred from the claim text.