Simultaneous selective deposition of two different materials on two different surfaces
AssigneeASM IP Holding B.V.
InventorsMichael Eugene Givens, Eva Tois, Suvi Haukka, Daria Nevstrueva, Charles Dezelah
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Abstract
In some embodiments, methods are provided for simultaneously and selectively depositing a first material on a first surface of a substrate and a second, different material on a second, different surface of the same substrate using the same reaction chemistries. For example, a first material may be selectively deposited on a metal surface while a second material is simultaneously and selectively deposited on an adjacent dielectric surface. The first material and the second material have different material properties, such as different etch rates.
Claims21
A method of selectively depositing different materials on a first surface and a different second surface of a substrate, the method comprising one or more deposition cycles comprising:
- exposing the first and the second surfaces of the substrate to a passivation agent such that a passivation layer is selectively formed on the first surface relative to the second surface;
- exposing the first surface, having the formed passivation layer, and the second surfaces to a first reactant such that a first element from the first reactant is selectively deposited on the second surface relative to the first surface;
- and
- exposing the first surface, having the passivation layer, and the second surface, having the deposited first element, to a second reactant such that a first material selectively forms on the first surface simultaneously with a second material selectively forming on the second surface, wherein one or more of an etch rate, a density, a conductivity, and a refractive index of the first material differs from that of the second material by at least about 5%.
A method of depositing different materials on a first surface and a different second surface of a substrate, the method comprising one or more deposition cycles comprising:
- exposing the first and the second surfaces of the substrate to a passivation agent such that a passivation layer is selectively formed on the first surface relative to the second surface, wherein the passivation layer prevents a first metal or semimetal from forming on the first surface;
- exposing the first and the second surfaces to a first reactant such that the first metal or semimetal from the first reactant is selectively deposited on the second surface relative to the first surface;
- and
- exposing the first surface and the second surface, having the deposited first metal or semimetal, to a second reactant including a second metal or semimetal such that a first material selectively forms on the first surface simultaneously with a second material selectively forming on the second surface, wherein the first material differs from the second material with respect to one or more of an etch rate, a density, a conductivity, and a refractive index.
Dependencies are inferred from the claim text.