Anti-flutter adhesive composition
AssigneeHenkel AG & Co. KGaA
InventorsJinFeng Zhong, Qi Chen
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Abstract
This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.
Claims17
An anti-flutter adhesive composition comprising:
- a) at least one ethylenically unsaturated rubber;
- b) at least one PVC homopolymer having a K value from 67 to 75;
- c) at least one PVC copolymer having a K value from 60 to 75;
- d) at least one epoxy resin;
- e) at least one epoxy curing agent;
- f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.;
- and
- g) at least one second organic peroxide having a decomposition temperature less than 125° C.;
- wherein the amount of the at least one first organic peroxide is from 0.4 to 0.8% by weight based on total weight of the composition;
- and the amount of the at least one second organic peroxide is from 0.2 to 1% by weight based on the total weight of the composition.
Dependencies are inferred from the claim text.