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US 12,539,666 B2Granted
Method for manufacturing molding die, and molding die
AssigneeSeiko Epson Corporation
InventorTatsuya Tsuboi
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a molding die used with an injection molder, the method including plasticizing a creating material containing metal particles and resin to produce a plasticized material, and dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die, with an average particle diameter D50 of the metal particles being smaller than or equal to 23 μm.
Claims9
A method for manufacturing a molding die used with an injection molder, the method comprising:
- plasticizing a creating material containing metal particles, resin, and a compatibilizer that is a silane coupling agent, to produce a plasticized material;
- and
- dispensing the plasticized material toward a stage to stack layers on each other to create a laminate that forms at least a portion of the molding die,
- wherein an average particle diameter D50 of the metal particles is smaller than or equal to 23 μm, and
- the metal particles are coated with the compatibilizer.
2 more elements
Dependencies are inferred from the claim text.