Silver particles, method for producing silver particles, paste composition, semiconductor device, and electrical and/or electronic components

A paste composition comprising:

• a plurality of silver particles that each include:
• a silver powder, wherein the silver powder has an average particle diameter (D50) of 1.59 to 2.45 μm, wherein the plurality of silver particles have a tap density from 4.0 to 7.0 g/cm3 and a specific surface area from 0.5 to 1.5 m2/g as determined by the BET method;
• an organic protecting compound, wherein a compounded amount of the organic protecting compound is from 1 to 5 mmol per mole of silver particles in the paste composition;
• and
• a silver layer, wherein the silver layer includes primary particles that are smaller than the silver powder and the primary particles have a mean particle size of 20-50 nm;
• a thermosetting resin, wherein the thermosetting resin is between 5 to 18 parts by mass relative to 100 parts by mass of the plurality of the silver particles;
• and
• a diluent, wherein the diluent is between 4 and 10 parts by mass relative to 100 parts by mass of the plurality of the silver particles, and wherein the diluent consists essentially of 3,5-dimethyl-1-adamantanamine;
• wherein the paste composition has a volume resistivity of 0.9-27 μΩ*cm.