Diamond-like carbon coating for passive and active electronics
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorsErik Joseph Timpson, Justin M. Schlitzer, Thomas Matthew Selter, Michael Walsh
Life of this patent
Estimating the term…
Abstract
Systems and methods for building passive and active electronics with diamond-like carbon (DLC) coatings are provided herein. DLC may be layered upon substrates to form various components of electronic devices. Passive components such as resistors, capacitors, and inductors may be built using DLC as a dielectric or as an insulating layer. Active components such as diodes and transistors may be built with the DLC acting substantially like a semiconductor. The amount of sp2 and sp3 bonded carbon atoms may be varied to modify the properties of the DLC for various electronic components.
Claims20
A transducer system comprising:
- a transducer, comprising:
- a substrate;
- a first bonding pad disposed on a first portion of the substrate;
- a diamond-like carbon (DLC) layer comprising:
- a first end in contact with the first bonding pad;
- a second end opposite the first end in contact with the substrate;
- and
- a middle region connecting the first end to the second end,
- wherein the middle region is thinner than the first end and the second end such that there is a gap between the middle region and the substrate, and
- wherein the DLC layer is configured to deform when a mechanical force is applied to the transducer,
- wherein the DLC layer is formed to have an electrical conductivity such that the DLC layer functions substantially like a semiconductor;
- and
- a second bonding pad disposed on the DLC layer,
- wherein the first bonding pad and the second bonding pad are conductive such that a charge is carried from the second bonding pad through the DLC layer and through the first bonding pad when the mechanical force is applied.
A transducer comprising:
- a substrate;
- a first bonding pad disposed on the substrate;
- a diamond-like carbon (DLC) layer comprising:
- a first end in contact with the first bonding pad;
- a second end opposite the first end and in contact with the substrate;
- and
- wherein the DLC layer is configured to deform when a mechanical force is applied to the transducer,
- wherein the DLC layer comprises an sp2/sp3 ratio such that the DLC layer functions substantially like a semiconductor;
- and
- a second bonding pad disposed on the DLC layer,
- wherein the first bonding pad and the second bonding pad are electrically conductive such that a charge is carried from the second bonding pad through the DLC layer and through the first bonding pad when the mechanical force is applied.
A transducer system comprising:
- a transducer, comprising:
- a substrate;
- a first electrically conductive bonding pad disposed on the substrate;
- a deformable diamond-like carbon (DLC) layer comprising a first end in contact with the first electrically conductive bonding pad and a second end opposite the first end and in contact with the substrate, and
- wherein the deformable DLC layer is formed to have an electrical conductivity such that the deformable DLC layer operates substantially like a semiconductor;
- and
- a second electrically conductive bonding pad disposed on the deformable DLC layer,
- wherein the deformable DLC layer is configured to transfer an electrical charge from the second electrically conductive bonding pad to the first electrically conductive bonding pad.
Dependencies are inferred from the claim text.