High efficiency thermal management devices for use with electronic components having high heat flux values
AssigneeThe Trustees of the California State University
InventorsShadi Mahjoob, Carlos Zing
Life of this patent
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Abstract
High efficiency heat management devices for use with electronic components, are disclosed and include: at least one jet inlet channel, at least one non-uniform channel area or uniform channel area, at least two exit channels, at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least one jet inlet channel, the at least two exit channels, and the at least one heat spreader conductive plate, and at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
Claims20
A heat management device for use with an electronic component, comprising:
- at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes,
- at least one non-uniform channel area or uniform channel area,
- at least two exit channels,
- at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and
- at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area.
A heat management device for use with an electronic component, comprises:
- at least two jet inlet channels, wherein the at least two jet inlet channels comprise at least two inlet channel sizes,
- at least one non-uniform channel area or uniform channel area,
- at least two exit channels,
- at least one heat spreader conductive plate, wherein the at least one non-uniform channel area or uniform channel area is bounded by the at least two jet inlet channels, the at least two exit channels, and the at least one heat spreader conductive plate, and
- at least one porous component or at least one foam component, wherein the at least one porous component or at least one foam component at least partially fills the at least one non-uniform channel area or uniform channel area,
- at least one jet impingement of at least one thermal management liquid or gas, wherein the at least two jet inlet channels directs the at least one jet impingement of a liquid or a gas onto a surface of the at least one porous component or at least one foam component.
Dependencies are inferred from the claim text.