Circuit board and method of manufacturing the same

A circuit board, comprising:

• a first embedded capacitor, comprising a dielectric layer, a first electrode and a second electrode, wherein the dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface, wherein the first electrode and the second electrode cover the first side surface and the third side surface respectively, wherein the first electrode comprises a first pad on the dielectric layer, a second pad beneath the dielectric layer, and an electrode plate physically connecting the first pad and the second pad;
• a substrate, surrounding the first embedded capacitor, wherein the substrate is physically connected to the second side surface and the fourth side surface of the dielectric layer, and the first electrode is located between the first side surface and a sidewall of the substrate;
• and
• an insulating layer, covering the first embedded capacitor and the substrate, wherein the insulating layer extends from an upper surface of the substrate to a lower surface of the substrate along the first electrode and the sidewall.