Piezoelectric microelectromechanical system microphone
AssigneeSkyworks Solutions, Inc.
InventorSiarhei Dmitrievich Barsukou
Life of this patent
Estimating the term…
Abstract
A piezoelectric microelectromechanical system microphone has a piezoelectric sensor layer with at least two sensing electrodes and at least one piezoelectric layer. Each piezoelectric layer can deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric layer. The sensing electrodes and the at least one piezoelectric layer form a stacked electrode structure. Each sensing electrode is disposed on or below a corresponding piezoelectric layer and senses the generated electrical potential. At least one of the sensing electrodes can include first corrugations which are configured such to release residual stress and to improve sensitivity of the microelectromechanical system microphone.
Claims20
A microelectromechanical microphone including:
- a substrate;
- a sensor layer supported by the substrate, the sensor layer including at least two sensing electrodes and at least one piezoelectric layer, the at least two sensing electrodes and the at least one piezoelectric layer stacked together to form a stacked electrode structure, the at least one piezoelectric layer configured to deform and generate an electrical potential responsive to impingement of sound waves on the at least one piezoelectric layer, the at least two sensing electrodes configured to sense the electrical potential, and at least one sensing electrode of the at least two sensing electrodes including first corrugations which are configured such to release residual stress and to improve sensitivity of the microelectromechanical microphone.
A wireless device comprising:
- an antenna configured to send and receive wireless signals;
- at least one microelectromechanical microphone including a sensor layer, the sensor layer including at least two sensing electrodes and at least one piezoelectric layer, the at least two sensing electrodes and the at least one piezoelectric layer stacked together to form a stacked electrode structure, the at least one piezoelectric layer configured to deform and generate an electrical potential responsive to impingement of sound waves on the at least one piezoelectric layer, the at least two sensing electrodes configured to sense the electrical potential, and at least one sensing electrode of the at least two sensing electrodes including first corrugations which are configured such to release residual stress and to improve sensitivity of the at least one microelectromechanical microphone.
A method of forming a piezoelectric microelectromechanical system microphone, the method comprising:
- providing a support substrate;
- depositing a film of piezoelectric material on the support substrate to form a piezoelectric sensor layer, the piezoelectric sensor layer secured to the support substrate about a perimeter of the piezoelectric sensor layer and including a central region defined within the perimeter that is free to deform and generate an electrical potential responsive to impingement of sound waves on the film of piezoelectric sensor layer;
- forming sensing electrodes on one or both of upper and lower surfaces of the piezoelectric sensor layer;
- and
- forming first corrugations in at least one first sensing electrode of the sensing electrodes.
Dependencies are inferred from the claim text.