Semiconductor device manufacturing system and semiconductor device manufacturing method
AssigneeHitachi High-Tech Corporation
InventorsToru Aramaki, Go Saito, Kenichiro Komeda, Yuji Enomoto, Takashi Tsutsumi
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AssigneeHitachi High-Tech Corporation
InventorsToru Aramaki, Go Saito, Kenichiro Komeda, Yuji Enomoto, Takashi Tsutsumi
Estimating the term…
The invention is to provide a semiconductor manufacturing apparatus system and a semiconductor device manufacturing method for reducing particles having an adverse effect in a manufacturing step of a semiconductor device. A semiconductor device manufacturing system, includes: a semiconductor manufacturing apparatus; and a platform connected to the semiconductor manufacturing apparatus via a network and in which a particle reduction processing is executed, in which the particle reduction processing includes: a step of acquiring a particle characteristic value by using a sample processed by the semiconductor manufacturing apparatus; a step of specifying a component of the semiconductor manufacturing apparatus leading to a particle generation based on the acquired particle characteristic value and correlation data by machine learning; a step of defining a cleaning condition for cleaning the semiconductor manufacturing apparatus based on the specified component; and a step of cleaning the semiconductor manufacturing apparatus using the defined cleaning condition, and the correlation data is correlation data between the particle characteristic value acquired in advance and the component.
A semiconductor device manufacturing system, comprising:
A semiconductor device manufacturing method for manufacturing a semiconductor device using a semiconductor manufacturing apparatus, the semiconductor device manufacturing method comprising:
A semiconductor device manufacturing system, comprising:
Dependencies are inferred from the claim text.