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US 12,535,839 B2Granted
Component communications in system-in-package systems
AssigneeOctavo Systems LLC
InventorsKevin Michael Troy, Peter Robert Linder
Life of this patent
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Abstract
A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be reconfigured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.
Claims6
A system, comprising:
- a System-in-Package (SiP) device having an internal power management device, one or more internal components, and a plurality of external connectors;
- and
- at least one external power supply for powering the system,
- wherein the internal power management device of the SiP is configurable using a first set of the external connectors,
- wherein the at least one external power supply provides power to the internal power management device of the SiP using a second set of the external connectors,
- wherein the at least one external power supply provides power to one or more of the internal components of the SiP using a third set of external connectors, and
- wherein the system is configured such that:
- the at least external power supply does not provide power to internal components of the SiP using the third set of external connectors during a low power mode of operation of the system, and
- the at least external power supply provides power to the internal components of the SiP using the third set of external connectors during a high performance mode of operation of the system.
6 more elements
Dependencies are inferred from the claim text.