US 12,535,362 B2Granted

Method of stabilizing temperature sensing in the presence of temperature-sensing component temperature variation

AssigneeNational Chung Shan Institute of Science and Technology

InventorsShiang-Feng Tang, Shun-Lung Yen, Kuo-Jen Chang, Hsin-Chang Chen

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Abstract

A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and obtaining instant corrected value of the response value of the black body.

A method of stabilizing temperature sensing in the presence of temperature variation of a thermal imager core chip, the method comprising the steps of:

(S1) obtaining a response value (x) from the thermal imager core chip at a first temperature (T1) while the temperature of the thermal imager core chip is rising, causing the response value to decrease;
(S2) obtaining, by preliminary experiment, a high-temperature first-order linear function (fH(T)) expressing relationship between a high-temperature black body response value and the thermal imager core chip temperature, wherein the high-temperature first-order linear function is obtained through derivation of a relationship between the high-temperature black body response value and a time and a relationship between the thermal imager core chip temperature and the time;
(S3) obtaining, by preliminary experiment, a low-temperature first-order linear function (fL(T)) expressing relationship between a low-temperature black body response value and the thermal imager core chip temperature, wherein the low-temperature first-order linear function is obtained through derivation of a relationship between the low-temperature black body response value and a time and a relationship between the thermal imager core chip temperature and the time;
(S4) obtaining a response value (fH(T1)) of the high-temperature first-order linear function at the first temperature, a response value (fH(T2)) of the high-temperature first-order linear function at a second temperature (T2) of the thermal imager core chip, a response value (fL(T1)) of the low-temperature first-order linear function at the first temperature, a response value (fL(T2)) of the low-temperature first-order linear function at the second temperature, and a response value (x) of the black body and substituting the five values into an equation for correcting the response values,
wherein the equation for correcting the response values is as follows:
d
=
{
[
1
-
f
H
(
T
1
)
-
x
f
H
(
T
1
)
-
f
L
(
T
1
)
]
×
[
f
H
(
T
1
)
-
f
H
(
T
2
)
]
}
+
[
1
-
x
-
f
L
(
T
1
)
f
H
(
T
1
)
-
f
L
(
T
1
)
]
×
[
f
L
(
T
1
)
-
f
L
(
T
2
)
]
}
where d denotes the instant corrected value,
x denotes the response value of the black body,
fH(T1) denotes the response value of the high-temperature first-order linear function at the first temperature,
fH(T2) denotes the response value of the high-temperature first-order linear function at the second temperature,
fL(T1) denotes the response value of the low-temperature first-order linear function at the first temperature, and
fL(T2) denotes the response value of the low-temperature first-order linear function at the second temperature;
(S5) obtaining an instant corrected value (d) of the response value (x) of the black body;
and
(S6) calibrating the value (x) of the black body by the instant corrected value (d) to obtain a calibrated response value of the black body.

99 more elements

Facts

Application

17/707,997Filed 30 Mar 2022

Published

US 2023/0314238 A15 Oct 2023

Granted

27 Jan 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

G01K 1/20
Details of thermometers not specially adapted for particular types of thermometer: compensating for effects of temperature changes other than…
G01J 5/53
Using comparison with reference sources, e.g. disappearing-filament pyrometer: reference sources, e.g. standard lamps; Black bodies
G01J 5/70
Radiation pyrometry, e.g. infrared or optical thermometry: passive compensation of pyrometer measurements, e.g. using ambient temperature sensing…
G01J 5/80
Radiation pyrometry, e.g. infrared or optical thermometry: calibration

Abstract

Claims2