Workpiece processing apparatus with thermal processing systems

A processing apparatus for processing a workpiece, the workpiece having a top side and a back side opposite from the top side, the processing apparatus comprising:

• a processing chamber having a first side and a second side opposite from the first side of the processing chamber;
• a workpiece support disposed within the processing chamber, the workpiece support configured to support the workpiece, wherein the back side of the workpiece faces the workpiece support;
• a rotation system configured to rotate the workpiece support;
• a gas delivery system configured to flow one or more process gases into the processing chamber;
• one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained;
• one or more pumping plates dispose around an outer perimeter of the workpiece to facilitate process gas flow;
• a first group of one or more radiative heating sources disposed on the first side of the processing chamber, the first group of one or more radiative heating sources configured to heat the workpiece from the top side of the workpiece;
• a second group of one or more radiative heating sources disposed on the second side of the processing chamber, the second group of one or more radiative heating sources configured to heat the workpiece from the back side of the workpiece;
• a first dielectric window disposed between the first group of one or more radiative heating sources disposed on the first side of the processing chamber and the workpiece;
• a second dielectric window disposed between the second group of one or more radiative heating sources disposed on the second side of the processing chamber and the workpiece support;
• and
• a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a temperature measurement indicative of a temperature of the back side of the workpiece.