Polishing liquid and polishing method
AssigneeResonac Corporation
InventorsHiroshi Ono, Keisuke Inoue, Takahiro Jinushi
Life of this patent
Estimating the term…
Abstract
A polishing liquid for polishing a surface to be polished containing a tungsten material, the polishing liquid containing abrasive grains, an iron-containing compound, and an oxidizing agent, in which the abrasive grains include silica particles, an average particle diameter of the abrasive grains is 40 to 140 nm, and a silanol group density of the silica particles is 8.0 groups/nm2 or less. A polishing method of polishing a surface to be polished containing a tungsten material by using the polishing liquid.
Claims17
A polishing liquid for polishing a surface to be polished containing a tungsten material, the polishing liquid comprising:
- abrasive grains;
- an iron-containing compound;
- and an oxidizing agent, wherein
- the abrasive grains include silica particles,
- an average particle diameter of the abrasive grains is 40 to 140 nm,
- a silanol group density of the silica particles is 5.5 to 8.0 groups/nm2, and
- a content of aluminum atoms is less than 0.000006% by mass on the basis of the total mass of the polishing liquid.
A polishing liquid for polishing a surface to be polished containing a tungsten material, the polishing liquid comprising:
- abrasive grains;
- an iron-containing compound;
- and an oxidizing agent, wherein
- the abrasive grains include silica particles,
- an average particle diameter of the abrasive grains is 40 to 140 nm,
- a silanol group density of the silica particles is 8.0 groups/nm2 or less,
- a zeta potential of the abrasive grains is 3.0 mV or less, and
- a content of aluminum atoms is less than 0.000006% by mass on the basis of the total mass of the polishing liquid.
Dependencies are inferred from the claim text.