Metal paste
AssigneeTANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
InventorsHiroki Sato, Yuki Fujita, Teruhisa Iwai, Yuusuke Ohshima, Shuntaro Takahashi, Shigeyuki Ootake
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AssigneeTANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
InventorsHiroki Sato, Yuki Fujita, Teruhisa Iwai, Yuusuke Ohshima, Shuntaro Takahashi, Shigeyuki Ootake
Estimating the term…
The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240° C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPa1/2 or less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.
A metal paste comprising a solid content of a silver particle having a protective agent bound to the particle and kneaded with a solvent,
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