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US 12,534,584 B2Granted
Resin composition, prepreg, resin-attached film, resin-attached metal foil, metal-cladded laminate sheet, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTakahiro Yamada, Hiroyuki Fujisawa, Yuji Yamada
Life of this patent
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Abstract
A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent. In Formula (1), R1 represents a hydrogen atom or an alkyl group.
Claims8
A resin composition comprising:
- a maleimide compound represented by the following Formula (3);
- a polyphenylene ether compound having an unsaturated double bond in a molecule;
- a phosphorus-containing compound
- represented by the following Formula (18);
- and
- a curing agent:
- wherein in Formula (18), R1 represents a methyl group;
- wherein in Formula (3), s represents 1 to 5 and RA, RB, RC, and RD represent a hydrogen atom,
- wherein the curing agent contains at least one of a triallyl isocyanurate compound, a diallyl bisphenol compound, and tricyclodecanedimethanol dimethacrylate,
- wherein a content of the maleimide compound is 10 to 75 parts by mass with respect to 100 parts by mass of the sum of the maleimide compound, the polyphenylene ether compound, and the curing agent, and
- wherein a content of the phosphorus-containing compound is 2 to 20 parts by mass with respect to 100 parts by mass of a sum of the maleimide compound, the polyphenylene ether compound, and the curing agent.
8 more elements
Dependencies are inferred from the claim text.