Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

A resin composition comprising:

• a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain;
• a radical polymerizable resin or compound (B) other than the bismaleimide compound (A);
• and
• a curing accelerator (C),
• wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group:
• wherein Q1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms;
• Q2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms;
• each Q3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms;
• and each n1 independently represents an integer of 1 to 10.