US 12,534,426 B2Granted

Leveler and electroplating composition for filling via hole

AssigneeYmt Co., Ltd.

InventorsDea Geun Kim, Sung Wook Chun, Bo Mook Chung, Nak Eun Ko

Life of this patent

Estimating the term…

Abstract

The present invention relates to a leveler capable of efficiently filling the inside of via holes formed during the manufacturing process of a printed circuit board, and an electroplating composition comprising the same. When via holes on a substrate are filled with the electroplating composition according to the present invention, the via holes can be filled in a relatively short time while minimizing the formation of dimples or voids.

Claims5

Dependent claims

A leveler represented by a compound,

wherein the compound is Chemical Formula 8,
wherein x is an integer, and y is an integer.

Dependencies are inferred from the claim text.

Facts

Application: 18/342,397Filed 27 Jun 2023
Priority: KR 10-2022-007884228 Jun 2022
Published: US 2024/0140905 A12 May 2024
Granted: 27 Jan 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

C07C 217/76
Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton: having amino groups bound to carbon atoms of…
C07D 233/64
Having two double bonds between ring members or between ring members and non-ring members: with substituted hydrocarbon radicals attached to ring…
C07D 241/12
Having three double bonds between ring members or between ring members and non-ring members: with only hydrogen atoms, hydrocarbon or substituted…
C23C 18/1653
Multilayered product: two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Family

US 2024/0140905 A1Pre-grant publication · published 2 May 2024
US 12,534,426 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

patentgrep

Loading patent…

patentgrepSearch patents

Back to results