Push through blister package with UV laser produced engraving or etching and methods of making thereof
AssigneeLiveo Research AG
InventorsAjith Sashidharan Nair, Eric Charles Shockey, Andreas Josef Pfefferle, Carsten Heldmann
Life of this patent
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Abstract
Provided are a blister package and a method of making thereof. The blister package includes a rupturable substrate; and a blister layer overlayed by the substrate, thereby making a cavity between the rupturable substate and the blister layer. The rupturable substrate at least partially forms an engraving or etching that reduces push through force required for dispensing a product stored inside the cavity for customer dispensing. The rupturable substate and the blister layer are made of the same or same class plastic or polymer thereby making the blister package recyclable.
Claims20
A blister package comprising:
- a rupturable substrate;
- and
- a blister layer overlayed by the substrate, thereby making a cavity between the rupturable substate and the blister layer,
- wherein the rupturable substrate at least partially forms a UV laser produced engraving or etching that reduces push through force required for dispensing a product stored inside the cavity for customer dispensing, and
- wherein the rupturable substate and the blister layer are made of the same or same class plastic, thereby making the blister package recyclable.
A blister package comprising:
- a substrate;
- and
- a rupturable blister layer overlayed by the substrate, thereby making a cavity between the substate and the rupturable blister layer,
- wherein the rupturable blister layer at least partially forms a UV laser produced engraving or etching that reduces push through force required for dispensing a product stored inside the cavity for customer dispensing, and
- wherein the substate and the rupturable blister layer are made of the same or same class plastic, thereby making the blister package recyclable.
A method of making a blister package:
- sealing a substrate over a blister layer, thereby making a cavity between the rupturable substate and the blister layer, and
- forming, by a UV laser, an engraving or etching on a portion of the substrate,
- wherein the rupturable substate and the blister layer are made of the same or same class plastic, thereby making the blister package recyclable and wherein the engraving or etching adapts the substrate to be rupturable at or about the portion of the substrate.
Dependencies are inferred from the claim text.