Microfluidic chip assembly for rapidly performing digital polymerase chain reaction (PCR), and use thereof
AssigneeSuzhou Precigenome Ltd, Co.
InventorsChen Li, Yunfeng Ling, Yu Liu, Hua Zhang, Yaqi Wang
Life of this patent
Estimating the term…
Abstract
A microfluidic chip assembly for rapidly performing digital polymerase chain reaction (PCR) and use thereof are provided. The microfluidic chip assembly includes at least one microfluidic chip, a heat sink arranged below the microfluidic chip, a heater arranged above the microfluidic chip, a semiconductor cooler arranged between the heat sink and the microfluidic chip, and a heat-conducting plate arranged above the semiconductor cooler. A thin film layer is bonded at the bottom of the microfluidic chip, and the thin film layer abuts against the heat-conducting plate.
Claims7
A microfluidic chip assembly for rapidly performing digital polymerase chain reaction (PCR), comprising:
- at least one microfluidic chip, wherein each of the at least one microfluidic chip comprises a sealing cover, a chip body, a thin film layer, an oil well, a sample well, and a waste liquid well;
- the chip body comprises multiple microfluidic channels and is defined with a top surface and a bottom surface;
- the sealing cover covers the top surface of the chip body to form an upper surface of each of the at least one microfluidic chip and comprises through holes that match the oil well, the sample well, and the waste liquid well and sealing filters fitted inside the through holes, respectively;
- the bottom surface of the chip body is sealed with the thin film layer, and the thin film layer has a thickness of 10 μm to 500 μm, and a total thickness of the at least one microfluidic chip is about 1 mm to 5 mm,
- a heat sink arranged below the at least one microfluidic chip,
- a semiconductor cooler arranged between the heat sink and the at least one microfluidic chip,
- a heat-conducting plate arranged above the semiconductor cooler, wherein the thin film layer of the at least one microfluidic chip abuts against the heat-conducting plate,
- a heater being positioned above the at least one microfluidic chip, wherein the heater is provided with a metal block to transmit heat to the at least one microfluidic chip with one side of the metal block attached to the upper surface of each of the at least one microfluidic chip, the heater is a heating resistor or a ceramic heater, and
- a pneumatic press plate being positioned above the heater, wherein the pneumatic press plate is attached to the other side of the metal block from the heater;
- and
- wherein both heating and cooling rates of a sample inside the at least one microfluidic chip exceed 5° C./s.
Dependencies are inferred from the claim text.